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Confidential · Internal & Partner Access

STAR-PHASER chip reference

This page contains proposal-grade architecture for STAR-PHASER TETRIS — the last pure Region I chip and the AWG-resolution scaling stress test. Enter the access password to continue.

Confidential · STAR-PHASER Chip Lineup · WS13 S31–S40

TETRIS

Transdimensional Encoding Test for Region-I Interferometric Spectral control

STAR-PHASER · d=32 · GF(2⁵) · Last pure STAR-PHASER

TETRIS is the final gate-locked product in Region I (Q < 0.2) before the lineup crosses into QUASAR NOVA (d=64, Region II). One photon, thirty-two spectral colors, 5 bits/photon, native GF(32) = GF(2⁵) algebraic control — a deliberate scaling stress test, not a shipping v1 SKU.

d=32 qudit GF(2⁵) field Region I · Q<0.2 Δf = 50 GHz 992 phase pairs AWG limit flagged
Campaign flag · S35

From TETRIS upward, AWG spectral resolution and adjacent-channel crosstalk — not OPC bandwidth — become the first fab-limited routing ceiling. OPC remains broadband (>12 THz); Hilbert dimension stays comfortable at d=32. Spectral routing fidelity does not.

Identity card

TETRIS specification ledger

Canonical numbers from WS13 Δf table and S31–S40 corpus.

Stability position
Q = (H_NL + H_OPC + H_CV) / H_linear

Region I (STAR-PHASER):  Q < 0.2   ← TETRIS lives here
Region II (QUASAR):      0.2 – 1     ← NOVA begins

TETRIS: last chip where OPC is a
periodic weak perturbation beneath
digital QEC — not a field-computing layer.

Lineage: GEMINI (d=2) → SOLAR (d=10) → GALAXY (d=16) → TETRIS (d=32)Region boundary → NOVA (d=64, QUASAR).

Property Value Status
Hilbert dimension d32 = 2⁵roadmap
Algebraic layerGF(32) = GF(2⁵), char 2roadmap
Bits / photon5info-theoretic
Comb spacing Δf50 GHzdesigned/target
Comb span Bcomb≈1.55 THz (31×Δf)model
OPC bandwidth margin≫12 THz (~8× headroom)claim
Phase relationshipsN(N−1) = 992model
FWM pathways~32k (d²(d−1))model
QFP cells (~Reck)~496model
First fab limit (TETRIS↑)AWG resolution / crosstalkflagged
STAR-PHASER purityLast Region I linear chipstrategic
TETRIS hero — 32 spectral lines in one waveguide, GF(2⁵) field layer, OPC band, last pure STAR-PHASERT-01 · Hero
Art direction (S31). Dark QLT palette: 32 vertical spectral lines in one waveguide, gradient teal→violet, bracket labeled "1 photon · d=32 · GF(2⁵)". Left inset: 5-bit XOR-add + log-multiply ROM. Right inset: OPC band ">12 THz" conjugating all 32 lines in one FWM pass. Bottom ribbon: "Region I · Q<0.2 · Last pure STAR-PHASER · AWG resolution gates scale from here."
§1 · Positioning

Scaling stress test thesis

S31 — why TETRIS exists on the encoding ladder.

S31

Three hypotheses, one die

Field arithmetic · OPC one-pass · Fab stops before physics
H1GF(32)

5-bit field arithmetic on QFP mesh

GF(32) log/antilog multiply, XOR-add, and RS(31,·) syndrome extraction remain tractable on the quantum frequency processor mesh. Primitive polynomial p(x) = x⁵ + x² + 1 committed globally; bin k labeled α^k.

How we do it: 5-bit symbol registers for GFADD/GFMUL kernels alongside SU(32) QFP cascade (S33).

H2OPC

OPC still one-pass at 1.55 THz

1.55 THz comb span ≪ 12 THz FWM acceptance — conjugation should remain bin-uniform if pump power and β₂ engineering scale. Relative spectral encoding preserves inter-bin phase relationships across all 32 lines.

How we do it: Hybrid Si₃N₄/As₂S₃ OPC nodes every M=10 gates; comb-derived multi-pump refresh (G45).

H3AWG

Fab stops before physics

32-channel AWG demux, comb lock, and crosstalk isolation fail before OPC bandwidth or Hilbert dimension. TETRIS asks explicitly: can we jump GALAXY→NOVA, or is the 32-ch AWG de-risk necessary?

Campaign flag: AWG resolution gates scale from TETRIS upward

TETRIS stress-test dashboard — OPC bandwidth, AWG resolution limit, 992 phase pairs, ~32k FWM pathwaysT-02 · Dashboard
Stress-test gauges (S31). Four quadrants: (1) OPC bandwidth — green, 1.55/12 THz. (2) Phase relationships — yellow, 992/4032 (NOVA reference). (3) AWG resolution — red, "LIMITING from TETRIS↑". (4) FWM pathways — orange, ~32k crosstalk sketch.
§2 · Encoding physics

Dense frequency packing at d=32

S32 — 32-dimensional frequency-bin Hilbert space and GF(32) labeling.

Single-photon qudit state: |ψ⟩ = Σk=031 ck|fk⟩ with Σ|ck|² = 1. Bins separated by Δf = 50 GHz; comb spans Bcomb ≈ 1.55 THz centered near 1550 nm.

p(x) = x⁵ + x² + 1   (primitive over GF(2))
GF(32) ≅ GF(2)[x]/(p(x))
|f_k⟩ ↔ α^k   for k = 0…31

Pathways ≈ d²(d−1) = 32² × 31 ≈ 31,744 ≈ 32k

Critical honesty: Bin index k is not integer addition in GF(32). Gates implementing X₃₂ are SU(32) permutations, not field addition.

Orthogonality vs AWG roll-off

At d=32, filter skirt overlap between bins k and k±1 becomes non-negligible if AWG 3-dB bandwidth exceeds ~40 GHz — directly tying encoding physics to AWG resolution.

Δf50 GHz (recommended)
Per-bin δf (EOM)~5–10 GHz FWHM
Guard ratio Δf/δf≈5–10×
Raman null~7.4 THz detuning (~15 bins)

How we do it: Phase-locked 32-line comb; mask-programmed k → 5-bit polynomial ROM; EOM spectral shaping; 32-ch AWG drop filters with crosstalk < −20 dB target; OPC boundary preserves relative phases; β₂ engineering for walk-off < 1 ps across 1.55 THz.

TETRIS encoding physics — 32 frequency bands with AWG skirt overlap and ~32k FWM pathway networkT-03 · T-04
Encoding art (S32). Side-view: 32 frequency bands with ideal guard gaps vs realistic AWG-filtered skirt overlap. Network graph: ~32k FWM pathway edges on α⁰…α³¹ nodes; phase-matched subset highlighted orange.
§3 · Gate set & ISA

SU(32) cascade & 5-bit symbol kernels

S33 — QFP universal control and GF(32) classical arithmetic layer.

Reck decomposition
# tunable cells ≈ d(d−1)/2 = 496
Arbitrary U ∈ SU(32): O(d²) depth
Clifford generators: O(d) depth

Gate depth — not OPC bandwidth — is the primary quantum gate bottleneck. TETRIS is the first chip where 496 cells × 992 phase pairs forces hierarchical calibration (preview of NOVA ChiL).

5-bit GF(32) ISA
GFADDr3 = r1 ⊕ r2 (5-bit XOR)depth 1
GFMULlog + antilog mod 31depth 2
X₃₂|k⟩ → |k+1 mod 32⟩perm
Z₃₂(θ)|k⟩ → eiθ·k|k⟩phase ramp
QFP-U(θ⃗)one Reck cell496 LUT

Log/antilog ROM: 31 × 5 bits × 2 tables — trivial in FPGA BRAM adjacent to die.

How we do it: Clements/Reck on 32 frequency modes; thermo-optic slow tuning + EO fast gates; 496 θᵢ in calibration LUT updated by GAP05 OPC-as-sensor; OPC every M=10 layers; offline SU(32) decomposition with Clifford+T library for QEC cycles.

Limiting-factor hierarchy (S33)

SU(32) depth — primary quantum gate challenge · AWG resolution — readout/routing (flagged) · 992 phase pairs — calibration · ~32k FWM — secondary crosstalk · OPC bandwidth — not limiting at 1.55 THz

TETRIS SU(32) Reck mesh with 496 QFP cells and limiting-factor waterfall chartT-05 · T-06
Gate stack art (S33). Triangular Reck mesh with 496-cell badge; OPC nodes every 10 layers. Three-column chart: OPC BW full (green), AWG resolution 85% (red), QFP depth 70% (amber).
§4 · Source & fabrication

32-tooth phase-locked comb tile

S34 — heralded SFWM, octet tiling, localized As₂S₃ OPC.

Pump (1550 nm) → Si₃N₄ microring (Q>10⁵) → SFWM 32-line comb
    → EO flattening / missing-line fill → CEO lock → f_rep = 50 GHz
    → OPC boundary tap → 32-bin qudit channel

[Octet 0: f₀…f₇] [Octet 1: f₈…f₁₅] [Octet 2: f₁₆…f₂₃] [Octet 3: f₂₄…f₃₁]
     ↓ optional 4×8 ring pre-filter → unified 32-ch AWG demux
Materials stack
  • Si₃N₄ — routing, SFWM microring (0.01–0.1 dB/cm)
  • As₂S₃ overlay — OPC spirals only (~55 mm Leff)
  • TFLN / SiN EO — comb flattening, sideband injection
  • No full-chip chalcogenide — loss tax minimized
Fab acceptance (vs GALAXY d=16)
  • 32/32 lines within ±1 dB — hard gate
  • Demux IL < 4 dB/ch — AWG-limited
  • Crosstalk < −20 dB — S35
  • OPC η per bin > 0.5 uniform ±10%

How we do it: AIM/KOTURA-class SiN MPW + post-process As₂S₃ at OPC sites; CEO from f-2f interferometer; K=8×T=4 herald mux inherited from GEMINI lineage; acceptance test samples 992 pairwise phases; pump reject before QFP entry.

TETRIS die floorplan with four octet blocks and 32-line frequency comb spectrumT-07 · T-08
Fab art (S34). Die floorplan: microring source, four octet blocks, As₂S₃ OPC spirals at edges. Comb spectrum: 32 lines with red callout "AWG resolution limits demux — not comb generation."
§5 · Routing & demux

AWG resolution — the TETRIS ceiling

S35 — primary campaign flag for fab limits from TETRIS upward.

Required public statement
AWG resolution is the limiting fab factor from STAR-PHASER TETRIS upward. OPC bandwidth (>12 THz) and Hilbert dimension remain comfortable at d=32; spectral routing fidelity does not.
AWG parameterTETRIS targetGALAXY
Channel count3216
Spacing50 GHz50 GHz
3-dB passband≥ 40 GHz≥ 45 GHz
Adjacent crosstalk< −20 dB< −18 dB
IL per channel< 4 dB< 3.5 dB

At −20 dB crosstalk, leakage ≈ 1% per adjacent pair → ~31% cumulative leakage across 32 bins if uncorrected. OPC + calibration must witness and cancel leakage; otherwise SU(32) depth budget collapses.

Mitigation ladder: (1) single 32-ch AWG MPW · (2) 2×16 AWG tree (NOVA preview) · (3) 4×8 octet ring banks · (4) EO reconfigurable filters.

How we do it: AWG co-design with comb PLL (±1 GHz); measure 32×32 leakage matrix at fab test; feed GAP05 OPC-as-sensor correction; 32 SNSPD ports or 8× time-multiplexed readout; total readout IL < 6 dB target.

TETRIS AWG spectral routing with RESOLUTION LIMIT badge and limiting-factor waterfall chartT-09 · T-10
Routing art (S35). 32-line bus → AWG fan-out with red "RESOLUTION LIMIT · TETRIS+" badge. Waterfall chart: OPC BW and Hilbert dim green (low); AWG resolution red (high); calibration 992 amber; FWM 32k orange.
§6 · Calibration

992 pairwise phase relationships

S36 — N(N−1) = 32×31; 4.1× GALAXY, 0.25× NOVA.

Each φij = arg(⟨fi|U|fj⟩) must be held to < 0.05–0.1 rad for >99% gate fidelity. Brute-force per-MZI sweeps over 496 cells take hours to days — TETRIS requires OPC-as-sensor self-calibration and sparse pairwise witness protocols.

Witness pairs: O(N log N) ≈ 160 measurements
→ infer full 992 via mesh Jacobian
496 θᵢ LUT · 1 kHz fast / 1 Hz full refresh
Calibration hierarchy
  1. Layer 0 — Comb CEO + f_rep lock (all 32 lines)
  2. Layer 1 — Global OPC witness (common-mode cancel)
  3. Layer 2 — Sparse pairwise tomography (~160 witnesses)
  4. Layer 3 — Per-cell LUT update (496 θᵢ)
  5. Layer 4 — Drift prediction (ChiL preview)

AWG coupling: resolution failure appears as off-diagonal φij for |i−j|=1 — calibration and routing limits are coupled. How we do it: boot CEO → rep → AWG align → OPC low-power; graph spanning witness set; static 32×32 leakage matrix stored at fab test.

TETRIS calibration pyramid hierarchy and 32×32 phase relationship heatmapT-11 · T-12
Calibration art (S36). Pyramid: comb lock → OPC witness → 160 sparse witnesses infer 992 → 496 cell LUT. Heatmap: bright adjacent-band errors from AWG; white dots mark witness points; OPC correction reduces off-diagonal intensity.
§7 · OPC & CV

More critical per bin — not more difficult

S37 — last pure STAR-PHASER OPC architecture before QUASAR.

OPC node spec
PlatformSi₃N₄ + localized As₂S₃
η (single-pass)0.5–2% CW; 10–90% pulsed
Insertion~3 dB/pass → ~1 dB roadmap
PeriodEvery M=10 gates
GeometryG1 recirculating loop

OPC module physics unchanged; system role intensifies — 992 pairs amplify bin-nonuniform conjugation; ~32k FWM pathways increase parasitic pump coupling; AWG-limited routing means phase errors cannot be repaired by re-demuxing.

V_∞ ≤ exp(−M·σ²/(2η))   M=10, σ=0.08, η=0.5 → V_∞ ≈ 0.94
Target: η=0.9 pulsed, σ=0.05 → V_∞ ≈ 0.99

Comb-derived OPC (G45): each tooth k pumps neighbors (k±m); 32 simultaneous pump candidates — scheduled rotation across gate cycles minimizes ~32k pathway crosstalk. CV role: baseline squeezed vacua at encoding boundary; full distributed squeeze mesh deferred to NOVA+. How we do it: pump scheduling, Raman-null detuning, SBS guard, recirculating loop, OPC visibility feeds S36 witnesses.

Responsibility split: OPC fixes accumulated gate phase · AWG design fixes crosstalk leakage · calibration cancels residual matrix · OPC does not fix photon loss.
TETRIS OPC recirculating loop cross-section and pump rotation timelineT-13 · T-14
OPC art (S37). SiN/As₂S₃ node with φ→−φ conjugation on 32 lines; V_∞ plateau vs depth without OPC. Pump rotation frames 1–4 over 32-bin comb.
§8 · Coding & QEC

GF(32) syndrome richness

S38 — native finite-field QEC; OPC pre-layer, digital decode.

First STAR-PHASER chip with designed GF(32) Reed–Solomon, BCH, and qudit stabilizer layers. Each syndrome symbol carries 5 bits of diagnostic information vs 4 at GF(16) (GALAXY).

RS(31, 27): 4 parity symbols × 5 bits = 20 parity bits
Corrects t=2 symbol errors (d_min = 5)

X₃₂ |k⟩ = |k+1 mod 32⟩
Z₃₂ |k⟩ = ω^k |k⟩ ,  ω = e^{2πi/32}
Layered stack

Physical d=32 qudit → OPC phase pre-layer (every M=10, η≥0.5) → effective pZ ↓ (~35% → ~1% model) → GF(32) syndrome extraction → Berlekamp–Massey decode → logical correction. Loss from OPC IL + AWG IL → heralded erasure.

Syndrome mis-ID < 10⁻³/cycle requires XT < −20 dB AWG

How we do it: commit p(x)=x⁵+x²+1; ROM log/antilog + RS(31,27) generator polynomials; QFP projective measurement in Fourier basis; FPGA GF(32) decoder <1 µs; conjugate before syndrome round; SNSPD no-click → erasure flag.

TETRIS QEC layer stack pipeline and syndrome richness comparison across GALAXY, TETRIS, NOVAT-15 · T-16
QEC art (S38). Stack: bins → OPC → X₃₂/Z₃₂/M(a) stabilizers → RS encoder → logical 5-bit symbol. Bar chart: 4/5/6 bits per syndrome for GALAXY/TETRIS/NOVA vs AWG noise floor.
§9 · Applications

High-connectivity synthetic lattice

S39 — 32-vertex graphs, GF(32) crypto, 5-bit AI tiles.

Tier A — native fit
  • GF(2⁵) field arithmetic (AES-like primitives)
  • RS(31,·) codec acceleration
  • 5-bit photonic tensor tiles (G21 analog at m=5)
Synthetic lattice classes
  • K₃₂ — complete graph, full SU(32) mixing
  • Q₅ — hypercube 2⁵, 5-bit flip gates
  • C₃₂ — cycle, X₃₂ ring QEC
  • Vertex k ↔ bin |fk⟩; edge (i,j) ↔ QFP coupling

TETRIS validates whether the 992-phase / AWG-limited / ~32k-FWM stack delivers utility before QUASAR NOVA fab cost. First chip where single-photon spectral dimension matches 5-bit computer word width without NOVA's 64-ch AWG tree.

How we do it: GF(32) SDK (GFADD/GFMUL + QFP-U API); lattice compiler |V|≤32 → coupling schedule; RS accelerator classical-only path; research mode exports syndrome + 992-phase telemetry; decimal I/O via G04 transcoder optional.

TETRIS application hub with GF(32) crypto, RS codec, tensor tiles, QEC lab, and 32-node synthetic latticeT-17 · T-18
Applications art (S39). Hub: crypto/RS, synthetic lattice, 5-bit AI tile, qudit QEC lab, NOVA preview arrow — all roadmap. 32-node circle graph with QFP coupling edges.
STAR-PHASER lineup

Where TETRIS sits

GEMINI d=2 · TODAY SOLAR d=10 GALAXY d=16 TETRIS d=32 · YOU ARE HERE │ Region I │ II │ NOVA d=64 · QUASAR
Related

Today's chip vs tomorrow's stress test

GEMINI is the shipping STAR-PHASER reference SKU. TETRIS is the roadmap scaling stress test — interest form for research partners and diligence.