Thermal Evaporator
Kurt J. Lesker NANO 36 HIGH for GAP03 ● the primary chalcogenide deposition tool; single point of failure for OPC moduleRole in QLT Fabrication
The thermal evaporator is responsible for depositing a 500 nm stoichiometric As₂S₃ (arsenic trisulfide) thin film onto LIGENTEC Si₃N₄ waveguide chips. This hybrid nonlinear overlay enables optical parametric conversion (OPC) modules ● the core of QLT's GAP03 product line.
Chalcogenide glasses like As₂S₃ offer exceptional third-order nonlinearity (n₂ ≈ 2–5 × 10⁻¹⁸ m²/W, 100–200× fused silica) and broad mid-IR transparency (visible to >10 μm). Recent Nature Communications work (Xia et al., 2025) confirmed that low-temperature thermal deposition of chalcogenide films onto silicon nitride circuits enables reconfigurable nonlinear photonics without wafer bonding ● directly validating QLT's hybrid integration approach.
This is the MOST UNUSUAL deposition step in our process ● very few labs evaporate chalcogenide glasses onto photonic chips. The MIT group (Hu Lab) and ANU group (Luther-Davies, Madden) have published extensively on single-source thermal evaporation of As₂S₃ from resistively heated tantalum/tungsten boats under high vacuum (10⁻⁶–10⁻⁷ Torr), achieving films up to 5 μm thick with losses < 0.2 dB/cm at 1550 nm.
Process Requirements
| Parameter | Requirement |
|---|---|
| Material | As₂S₃ (6N purity, arc-melted, vacuum-degassed) |
| Target thickness | 500 nm ± 10 nm |
| Deposition rate | 5 nm/min ± 1 nm/min (slow for stoichiometry control) |
| Substrate temperature | 150°C ± 5°C (heated chuck) |
| Base pressure | < 5 × 10⁻⁷ Torr before evaporation |
| Process pressure | 1–5 × 10⁻⁶ Torr during evaporation |
| Post-dep anneal | 130°C, 24 hr, N₂ atmosphere (inside glove box) |
| Source type | Resistive thermal (tungsten boat or Ta/Mo crucible) |
| Thickness monitor | Quartz crystal microbalance (QCM) |
| Refractive index (target) | n ≈ 2.4 @ 1550 nm |
| Surface roughness | < 0.5 nm RMS (for low waveguide scattering loss) |
Why Thermal Evaporation
| Method | Stoichiometry | Damage to SiN | Cost | Film Quality |
|---|---|---|---|---|
| Thermal evaporation (our pick) | Excellent (binary ChG) | Minimal (low kinetic energy) | Low | Proven < 0.2 dB/cm loss |
| RF sputtering | Poor (preferential S loss) | Moderate (plasma bombardment) | Medium | Higher stress, porosity |
| Pulsed laser deposition (PLD) | Excellent (ultrafast PLD) | Minimal | 3× higher (excimer laser) | Excellent but particulate risk |
| Solution spin-coating | Moderate | None | Very low | Residual solvent issues |
Recommended Configuration
| Parameter | Specification |
|---|---|
| Manufacturer | Angstrom Engineering Inc., Kitchener/Waterloo, Ontario, Canada |
| Model | Nexdep (thermal evaporation configuration) |
| Website | angstromengineering.com |
| Contact | [email protected] |
| Chamber | D-shaped, 400 × 400 × 500 mm stainless steel or aluminum, sliding + hinged door |
| Sources | Up to 8 resistive thermal sources (boats/filaments/crucibles) |
| Source power | 2.5 kW SCR-controlled resistive thermal evaporation module |
| Base pressure | < 5 × 10⁻⁷ Torr (standard HV); < 9 × 10⁻⁹ Torr (UHV option) |
| Substrate size | Up to 150 mm standard (300 mm with custom fixturing) |
| Substrate heater | Up to 300°C |
| Substrate rotation | Motorized, 10–30 rpm, tilt-free horizontal |
| QCM | Water-cooled quartz crystal microbalance probe, rigid mounting |
| Vacuum gauging | Inficon MPG400 (3.75 × 10⁻⁹ to 760 Torr full range) |
| Roughing pump | Oil-sealed rotary vane, ≥ 9 cfm |
| High-vacuum pump | Turbomolecular, ≥ 685 L/s |
| Control | Aeres® PC/PLC-based software; automated recipe execution; PID auto-tuning |
| Glovebox integration | Available (critical for As₂S₃ handling) |
| Compliance | CE, CSA; ISO/IEC 17025 compatible |
The Nexdep is rated as a "workhorse" by 300-user clean room labs (NNCI member facilities). It supports reactive evaporation (optional O₂/N₂ injection) and can be retrofitted with sputtering cathodes or e-beam sources.
| Method | Stoichiometry | Damage to SiN | Cost | Film Quality |
|---|---|---|---|---|
| Thermal evaporation (our pick) | Excellent (binary ChG) | Minimal (low kinetic energy) | Low | Proven < 0.2 dB/cm loss |
| RF sputtering | Poor (preferential S loss) | Moderate (plasma bombardment) | Medium | Higher stress, porosity |
| Pulsed laser deposition (PLD) | Excellent (ultrafast PLD) | Minimal | 3× higher (excimer laser) | Excellent but particulate risk |
| Solution spin-coating | Moderate | None | Very low | Residual solvent issues |
| Parameter | Specification |
|---|---|
| Manufacturer | Angstrom Engineering Inc., Kitchener/Waterloo, Ontario, Canada |
| Model | Nexdep (thermal evaporation configuration) |
| Website | angstromengineering.com |
| Contact | [email protected] |
| Chamber | D-shaped, 400 × 400 × 500 mm stainless steel or aluminum, sliding + hinged door |
| Sources | Up to 8 resistive thermal sources (boats/filaments/crucibles) |
| Source power | 2.5 kW SCR-controlled resistive thermal evaporation module |
| Base pressure | < 5 × 10⁻⁷ Torr (standard HV); < 9 × 10⁻⁹ Torr (UHV option) |
| Substrate size | Up to 150 mm standard (300 mm with custom fixturing) |
| Substrate heater | Up to 300°C |
| Substrate rotation | Motorized, 10–30 rpm, tilt-free horizontal |
| QCM | Water-cooled quartz crystal microbalance probe, rigid mounting |
| Vacuum gauging | Inficon MPG400 (3.75 × 10⁻⁹ to 760 Torr full range) |
| Roughing pump | Oil-sealed rotary vane, ≥ 9 cfm |
| High-vacuum pump | Turbomolecular, ≥ 685 L/s |
| Control | Aeres® PC/PLC-based software; automated recipe execution; PID auto-tuning |
| Glovebox integration | Available (critical for As₂S₃ handling) |
| Compliance | CE, CSA; ISO/IEC 17025 compatible |
| Parameter | Specification |
|---|---|
| Manufacturer | Kurt J. Lesker Company, Jefferson Hills, PA |
| Model | NANO 36 |
| Chamber | 12" dia. × 18" high Pyrex bell jar or 16" SS box chamber (27–45 L) |
| Sources | Up to 4 thermal boats (2" assemblies); standard 12V @ 400A power supply |
| Base pressure | 5 × 10⁻⁷ Torr (turbo) or 9 × 10⁻⁷ Torr (diffusion) |
| Substrate size | Up to 200 mm (8") with optional rotation at 20 rpm |
| Substrate heater | Quartz lamp, to 350°C |
| Pumping | 260 L/s turbo (Pfeiffer) or 700 L/s diffusion; Edwards nXDS6i scroll roughing option |
| QCM | Quartz crystal controller standard with thermal option |
| Control | PC-based HMI with color touch screen |
| Glovebox integration | Native design ● uniquely suited for glovebox mounting |
| Weight | ~544 kg (1,200 lbs) |
| Footprint | 1270 × 940 × 1727 mm rack assembly |
| Compliance | CE, CSA; 12-month warranty |
Process Integration
QLT PROCESS FLOW ● Thermal Evaporator (Step G3): PRE-REQUISITES: ├── LIGENTEC SiN chip returned with waveguides + SiO₂ cladding (Step B1-B8) ├── OPC module windows opened by lithography + etch (Step G1-G2) └── Glovebox (#35) operational with N₂ atmosphere STEP 1: Source Preparation (Glovebox) ├── Weigh 2–3 g As₂S₃ bulk glass (6N, from AMI or IRradiance) ├── Crush to ~1 mm pieces with agate mortar under amber light └── Load into tungsten boat; place boat in sealed transfer container STEP 2: Chamber Preparation ├── Vent evaporator chamber with dry N₂ ├── Install loaded boat on source terminals (heavy copper lugs) ├── Mount chip on substrate holder (heated chuck, center position) ├── Install clean QCM crystal (Au-coated, 6 MHz) └── Close chamber; start pump-down sequence STEP 3: Pump-Down & Conditioning ├── Rough pump to < 100 mTorr (5 min) ├── Open gate valve to turbo pump ├── Pump to < 5×10⁻⁷ Torr (45–90 min) └── Start substrate heater ramp to 150°C STEP 4: Deposition ├── Ramp source current (1 A/s) until QCM reads 5 nm/min ├── Open substrate shutter ├── Monitor rate and thickness in real-time (Aeres® or QCM controller) ├── Total deposition time: ~100 minutes for 500 nm └── Close shutter when target thickness reached STEP 5: Cool-Down & Unload ├── Turn off source power; maintain substrate heater at 100°C for 10 min ├── Cool substrate to < 80°C ├── Vent with dry N₂ └── Transfer chip to glovebox immediately (minimize ambient exposure) STEP 6: Post-Deposition Anneal ├── Anneal at 130°C for 24 hours in N₂ (inside glovebox) └── This relieves film stress and stabilizes refractive index STEP 7: Qualification ├── Ellipsometry: verify n = 2.40 ± 0.02, thickness 500 ± 10 nm ├── Raman spectroscopy: verify As₂S₃ stoichiometry peaks └── Visual inspection under amber light: no cracks, delamination, or haze
Vendor Options & Pricing
New System Pricing
| Model | Configuration | Price (2025–2026 Est.) | Lead Time |
|---|---|---|---|
| Angstrom Nexdep (thermal, 2-source, QCM) | Standard HV, 150 mm | $80,000–$120,000 | 12–16 weeks |
| Angstrom Nexdep + glovebox integration | HV + N₂ glovebox pass-through | $120,000–$180,000 | 16–20 weeks |
| Kurt Lesker NANO 36 (thermal, 4-source) | Turbo pump, QCM, 200 mm | $40,000–$65,000 | 8–12 weeks |
| Kurt Lesker PVD 75 (thermal + options) | Box chamber, rotation, heater | $60,000–$100,000 | 10–14 weeks |
| Denton Explorer 14 (modern benchtop) | Turbo pump, PC control | $50,000–$80,000 | 8–12 weeks |
| VacCoat DST3 / DSR1 | Budget, modern | $15,000–$25,000 | 6–8 weeks |
Used/Refurbished Market
| Model | "As-Is" | Tested/Functional | Full Refurb w/Warranty |
|---|---|---|---|
| Denton DV-502A | $5,000–$12,000 | $12,000–$18,000 | $18,000–$25,000 |
| Edwards Auto 306 | $3,000–$8,000 | $8,000–$15,000 | $15,000–$22,000 |
| Kurt Lesker Nano 36 | $15,000–$25,000 | $25,000–$35,000 | $35,000–$45,000 |
| Angstrom Nexdep | Rarely available | $40,000–$60,000 | N/A (too new) |
| Generic bell-jar system | $2,000–$5,000 | $5,000–$10,000 | $10,000–$15,000 |
Vendor Directory
| Vendor | Type | Contact | Notes |
|---|---|---|---|
| Angstrom Engineering | OEM (new) | angstromengineering.com / [email protected] | Best for glovebox integration; Waterloo, ON |
| Kurt J. Lesker | OEM (new + used) | lesker.com / (412) 387-9200 | NANO 36 glovebox-native design; Jefferson Hills, PA |
| Denton Vacuum | OEM (new) | dentonvacuum.com | Explorer 14 modern benchtop |
| LabX | Used marketplace | labx.com | Strong evaporator listings |
| Moov Technologies | Used semiconductor | moov.co | PVD equipment listings |
| Surplus Record | Industrial surplus | surplusrecord.com | Denton/Edwards units common |
| eBay Industrial | Used | ebay.com | DV-502A frequently listed |
| Machinio | Equipment aggregator | machinio.com | Multi-vendor search |
| CAE Online | Used semiconductor | caeonline.com | Nano 36 and other listings |
Price History and Market Dynamics
THERMAL EVAPORATOR PRICE TREND (used Denton/Edwards class): 2018-2019: $5-12k (abundant academic surplus) 2020-2021: $6-15k (stable; some COVID lab closures reduced supply) 2022-2023: $8-18k (modest increase; photonics/MEMS demand growing) 2024-2025: $8-15k (stable; supply exceeds demand) 2025-2026: $8-15k (stable; FAVORABLE BUYER'S MARKET) TREND: Thermal evaporators are COMMODITY ITEMS in the used market. Every time a lab upgrades to e-beam or sputtering, they sell their thermal system. Prices are STABLE and LOW. KEY BUYERS: ├── Academic startup labs ├── MEMS packaging (Au/Cr adhesion layers) ├── Organic electronics / OPV research └── Chalcogenide photonics (our niche ● very small market)
Facility Requirements
Floor Space and Layout
| Dimension | Requirement |
|---|---|
| Footprint (Denton DV-502A) | 0.7 m × 0.7 m (28" × 28") bell jar |
| Footprint (Lesker Nano 36) | 1.27 m × 0.94 m (50" × 37") rack assembly |
| Footprint (Nexdep) | 0.4 m × 0.4 m chamber + rack |
| With pump + glovebox | 2.0 m × 1.5 m (with adjacent nitrogen glove box) |
| Service access | 0.6 m clearance on all sides |
| Total floor allocation | 2.6 m × 2.1 m (5.5 m²) |
| Weight (Denton DV-502A) | ~200 kg (440 lbs) |
| Weight (Lesker Nano 36) | ~544 kg (1,200 lbs) |
| Weight (Nexdep) | ~150–300 kg |
Electrical Requirements
| Component | Power Draw | Circuit Requirements |
|---|---|---|
| Source power supply (LV, high-current) | 1.0–2.5 kW (6–10 V, 100–400 A) | Single-phase 208/240 V, 30 A |
| Substrate heater | 0.2–0.5 kW | Same circuit or separate 120V/15A |
| Turbo-molecular pump | 0.3–0.5 kW | Continuous when tool is on |
| Roughing pump (dry scroll) | 0.5–0.8 kW | Continuous when tool is on |
| QCM controller | 0.05 kW | During deposition |
| Control PC + electronics | 0.1–0.2 kW | Continuous |
| TOTAL SYSTEM | 2.5–4.5 kW typical; 5 kW peak | 40–50 A total on 2 circuits |
NOTE: Thermal evaporators use LOW VOLTAGE, HIGH CURRENT source power supplies. The NANO 36 standard supply is 12V @ 400A. Heavy copper lugs are required between power supply and source feedthrough.
Environmental and Special Requirements
| Parameter | Specification |
|---|---|
| Vibration sensitivity | LOW ● thermal evaporation is NOT vibration-sensitive |
| Anti-vibration table | Not required |
| Special lighting | AMBER/RED LIGHTING (≥ 580 nm cutoff) for As₂S₃ handling |
| Lighting reason | As₂S₃ is photosensitive below ~600 nm; UV/blue exposure causes photodarkening (Δn up to 0.016) |
| Lighting cost | $200–$400 for amber LED panels |
| Sound (roughing pump) | 60–70 dB(A) at 1 m |
| Sound (turbo pump) | 50–55 dB(A) (high-pitched whine) |
| Cooling water | 1–2 GPM if chamber is water-cooled; many bell-jar systems are air-cooled |
| Temperature | Standard lab 18–25°C |
| Humidity | < 60% RH |
Safety & Handling
Hazard Summary
| Hazard | Source | Risk Level | Controls |
|---|---|---|---|
| Arsenic exposure | As₂S₃ source material, residues on boats/chamber | CRITICAL | Load/unload in N₂ glovebox; OSHA PEL = 10 μg/m³ TWA for As |
| Toxic waste | As₂S₃ on boats, crucibles, chamber walls | HIGH | EPA D004 hazardous waste; licensed disposal |
| Thermal burns | Hot source (300°C+), substrate heater (150°C) | MEDIUM | Cool-down SOP; warning labels |
| Electrical | High-current supply (100–400 A) | LOW | Interlocked; LOTO for maintenance |
| Vacuum implosion | Bell-jar systems | LOW | Implosion guard required on glass bell jars |
Required Safety Infrastructure
| Item | Cost | Notes |
|---|---|---|
| N₂ glovebox (#35) | Shared equipment | For As₂S₃ source loading/unloading |
| Personal arsenic exposure badges | $100/pack | For operators; quarterly monitoring |
| Area arsenic sampler | $500–$1,500 | Continuous monitoring recommended |
| PPE (nitrile gloves, lab coat, safety glasses) | $50/person | Standard |
| N95 respirator | $30/box | For source loading operations |
| SDS binder | ● | As₂S₃ SDS required on file |
| Hazmat waste containers | $100–$200 | Labeled for arsenic-containing waste |
Required Training
- Arsenic handling and awareness (EH&S certified)
- Vacuum system operation
- QCM operation and calibration
- Emergency procedures (arsenic spill response)
- LOTO for electrical maintenance