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Step 05 Metallization

Thermal Evaporator

Kurt J. Lesker NANO 36 HIGH for GAP03 ● the primary chalcogenide deposition tool; single point of failure for OPC module

Role in QLT Fabrication

The thermal evaporator is responsible for depositing a 500 nm stoichiometric As₂S₃ (arsenic trisulfide) thin film onto LIGENTEC Si₃N₄ waveguide chips. This hybrid nonlinear overlay enables optical parametric conversion (OPC) modules ● the core of QLT's GAP03 product line.

Chalcogenide glasses like As₂S₃ offer exceptional third-order nonlinearity (n₂ ≈ 2–5 × 10⁻¹⁸ m²/W, 100–200× fused silica) and broad mid-IR transparency (visible to >10 μm). Recent Nature Communications work (Xia et al., 2025) confirmed that low-temperature thermal deposition of chalcogenide films onto silicon nitride circuits enables reconfigurable nonlinear photonics without wafer bonding ● directly validating QLT's hybrid integration approach.

This is the MOST UNUSUAL deposition step in our process ● very few labs evaporate chalcogenide glasses onto photonic chips. The MIT group (Hu Lab) and ANU group (Luther-Davies, Madden) have published extensively on single-source thermal evaporation of As₂S₃ from resistively heated tantalum/tungsten boats under high vacuum (10⁻⁶–10⁻⁷ Torr), achieving films up to 5 μm thick with losses < 0.2 dB/cm at 1550 nm.

Process Requirements

ParameterRequirement
MaterialAs₂S₃ (6N purity, arc-melted, vacuum-degassed)
Target thickness500 nm ± 10 nm
Deposition rate5 nm/min ± 1 nm/min (slow for stoichiometry control)
Substrate temperature150°C ± 5°C (heated chuck)
Base pressure< 5 × 10⁻⁷ Torr before evaporation
Process pressure1–5 × 10⁻⁶ Torr during evaporation
Post-dep anneal130°C, 24 hr, N₂ atmosphere (inside glove box)
Source typeResistive thermal (tungsten boat or Ta/Mo crucible)
Thickness monitorQuartz crystal microbalance (QCM)
Refractive index (target)n ≈ 2.4 @ 1550 nm
Surface roughness< 0.5 nm RMS (for low waveguide scattering loss)

Why Thermal Evaporation

MethodStoichiometryDamage to SiNCostFilm Quality
Thermal evaporation (our pick)Excellent (binary ChG)Minimal (low kinetic energy)LowProven < 0.2 dB/cm loss
RF sputteringPoor (preferential S loss)Moderate (plasma bombardment)MediumHigher stress, porosity
Pulsed laser deposition (PLD)Excellent (ultrafast PLD)Minimal3× higher (excimer laser)Excellent but particulate risk
Solution spin-coatingModerateNoneVery lowResidual solvent issues

Recommended Configuration

ParameterSpecification
ManufacturerAngstrom Engineering Inc., Kitchener/Waterloo, Ontario, Canada
ModelNexdep (thermal evaporation configuration)
Websiteangstromengineering.com
Contact[email protected]
ChamberD-shaped, 400 × 400 × 500 mm stainless steel or aluminum, sliding + hinged door
SourcesUp to 8 resistive thermal sources (boats/filaments/crucibles)
Source power2.5 kW SCR-controlled resistive thermal evaporation module
Base pressure< 5 × 10⁻⁷ Torr (standard HV); < 9 × 10⁻⁹ Torr (UHV option)
Substrate sizeUp to 150 mm standard (300 mm with custom fixturing)
Substrate heaterUp to 300°C
Substrate rotationMotorized, 10–30 rpm, tilt-free horizontal
QCMWater-cooled quartz crystal microbalance probe, rigid mounting
Vacuum gaugingInficon MPG400 (3.75 × 10⁻⁹ to 760 Torr full range)
Roughing pumpOil-sealed rotary vane, ≥ 9 cfm
High-vacuum pumpTurbomolecular, ≥ 685 L/s
ControlAeres® PC/PLC-based software; automated recipe execution; PID auto-tuning
Glovebox integrationAvailable (critical for As₂S₃ handling)
ComplianceCE, CSA; ISO/IEC 17025 compatible

The Nexdep is rated as a "workhorse" by 300-user clean room labs (NNCI member facilities). It supports reactive evaporation (optional O₂/N₂ injection) and can be retrofitted with sputtering cathodes or e-beam sources.

MethodStoichiometryDamage to SiNCostFilm Quality
Thermal evaporation (our pick)Excellent (binary ChG)Minimal (low kinetic energy)LowProven < 0.2 dB/cm loss
RF sputteringPoor (preferential S loss)Moderate (plasma bombardment)MediumHigher stress, porosity
Pulsed laser deposition (PLD)Excellent (ultrafast PLD)Minimal3× higher (excimer laser)Excellent but particulate risk
Solution spin-coatingModerateNoneVery lowResidual solvent issues
ParameterSpecification
ManufacturerAngstrom Engineering Inc., Kitchener/Waterloo, Ontario, Canada
ModelNexdep (thermal evaporation configuration)
Websiteangstromengineering.com
Contact[email protected]
ChamberD-shaped, 400 × 400 × 500 mm stainless steel or aluminum, sliding + hinged door
SourcesUp to 8 resistive thermal sources (boats/filaments/crucibles)
Source power2.5 kW SCR-controlled resistive thermal evaporation module
Base pressure< 5 × 10⁻⁷ Torr (standard HV); < 9 × 10⁻⁹ Torr (UHV option)
Substrate sizeUp to 150 mm standard (300 mm with custom fixturing)
Substrate heaterUp to 300°C
Substrate rotationMotorized, 10–30 rpm, tilt-free horizontal
QCMWater-cooled quartz crystal microbalance probe, rigid mounting
Vacuum gaugingInficon MPG400 (3.75 × 10⁻⁹ to 760 Torr full range)
Roughing pumpOil-sealed rotary vane, ≥ 9 cfm
High-vacuum pumpTurbomolecular, ≥ 685 L/s
ControlAeres® PC/PLC-based software; automated recipe execution; PID auto-tuning
Glovebox integrationAvailable (critical for As₂S₃ handling)
ComplianceCE, CSA; ISO/IEC 17025 compatible
ParameterSpecification
ManufacturerKurt J. Lesker Company, Jefferson Hills, PA
ModelNANO 36
Chamber12" dia. × 18" high Pyrex bell jar or 16" SS box chamber (27–45 L)
SourcesUp to 4 thermal boats (2" assemblies); standard 12V @ 400A power supply
Base pressure5 × 10⁻⁷ Torr (turbo) or 9 × 10⁻⁷ Torr (diffusion)
Substrate sizeUp to 200 mm (8") with optional rotation at 20 rpm
Substrate heaterQuartz lamp, to 350°C
Pumping260 L/s turbo (Pfeiffer) or 700 L/s diffusion; Edwards nXDS6i scroll roughing option
QCMQuartz crystal controller standard with thermal option
ControlPC-based HMI with color touch screen
Glovebox integrationNative design ● uniquely suited for glovebox mounting
Weight~544 kg (1,200 lbs)
Footprint1270 × 940 × 1727 mm rack assembly
ComplianceCE, CSA; 12-month warranty

Process Integration

QLT PROCESS FLOW ● Thermal Evaporator (Step G3):

PRE-REQUISITES:
├── LIGENTEC SiN chip returned with waveguides + SiO₂ cladding (Step B1-B8)
├── OPC module windows opened by lithography + etch (Step G1-G2)
└── Glovebox (#35) operational with N₂ atmosphere

STEP 1: Source Preparation (Glovebox)
├── Weigh 2–3 g As₂S₃ bulk glass (6N, from AMI or IRradiance)
├── Crush to ~1 mm pieces with agate mortar under amber light
└── Load into tungsten boat; place boat in sealed transfer container

STEP 2: Chamber Preparation
├── Vent evaporator chamber with dry N₂
├── Install loaded boat on source terminals (heavy copper lugs)
├── Mount chip on substrate holder (heated chuck, center position)
├── Install clean QCM crystal (Au-coated, 6 MHz)
└── Close chamber; start pump-down sequence

STEP 3: Pump-Down & Conditioning
├── Rough pump to < 100 mTorr (5 min)
├── Open gate valve to turbo pump
├── Pump to < 5×10⁻⁷ Torr (45–90 min)
└── Start substrate heater ramp to 150°C

STEP 4: Deposition
├── Ramp source current (1 A/s) until QCM reads 5 nm/min
├── Open substrate shutter
├── Monitor rate and thickness in real-time (Aeres® or QCM controller)
├── Total deposition time: ~100 minutes for 500 nm
└── Close shutter when target thickness reached

STEP 5: Cool-Down & Unload
├── Turn off source power; maintain substrate heater at 100°C for 10 min
├── Cool substrate to < 80°C
├── Vent with dry N₂
└── Transfer chip to glovebox immediately (minimize ambient exposure)

STEP 6: Post-Deposition Anneal
├── Anneal at 130°C for 24 hours in N₂ (inside glovebox)
└── This relieves film stress and stabilizes refractive index

STEP 7: Qualification
├── Ellipsometry: verify n = 2.40 ± 0.02, thickness 500 ± 10 nm
├── Raman spectroscopy: verify As₂S₃ stoichiometry peaks
└── Visual inspection under amber light: no cracks, delamination, or haze

Vendor Options & Pricing

New System Pricing

ModelConfigurationPrice (2025–2026 Est.)Lead Time
Angstrom Nexdep (thermal, 2-source, QCM)Standard HV, 150 mm$80,000–$120,00012–16 weeks
Angstrom Nexdep + glovebox integrationHV + N₂ glovebox pass-through$120,000–$180,00016–20 weeks
Kurt Lesker NANO 36 (thermal, 4-source)Turbo pump, QCM, 200 mm$40,000–$65,0008–12 weeks
Kurt Lesker PVD 75 (thermal + options)Box chamber, rotation, heater$60,000–$100,00010–14 weeks
Denton Explorer 14 (modern benchtop)Turbo pump, PC control$50,000–$80,0008–12 weeks
VacCoat DST3 / DSR1Budget, modern$15,000–$25,0006–8 weeks

Used/Refurbished Market

Model"As-Is"Tested/FunctionalFull Refurb w/Warranty
Denton DV-502A$5,000–$12,000$12,000–$18,000$18,000–$25,000
Edwards Auto 306$3,000–$8,000$8,000–$15,000$15,000–$22,000
Kurt Lesker Nano 36$15,000–$25,000$25,000–$35,000$35,000–$45,000
Angstrom NexdepRarely available$40,000–$60,000N/A (too new)
Generic bell-jar system$2,000–$5,000$5,000–$10,000$10,000–$15,000

Vendor Directory

VendorTypeContactNotes
Angstrom EngineeringOEM (new)angstromengineering.com / [email protected]Best for glovebox integration; Waterloo, ON
Kurt J. LeskerOEM (new + used)lesker.com / (412) 387-9200NANO 36 glovebox-native design; Jefferson Hills, PA
Denton VacuumOEM (new)dentonvacuum.comExplorer 14 modern benchtop
LabXUsed marketplacelabx.comStrong evaporator listings
Moov TechnologiesUsed semiconductormoov.coPVD equipment listings
Surplus RecordIndustrial surplussurplusrecord.comDenton/Edwards units common
eBay IndustrialUsedebay.comDV-502A frequently listed
MachinioEquipment aggregatormachinio.comMulti-vendor search
CAE OnlineUsed semiconductorcaeonline.comNano 36 and other listings

Price History and Market Dynamics

THERMAL EVAPORATOR PRICE TREND (used Denton/Edwards class):

2018-2019:  $5-12k (abundant academic surplus)
2020-2021:  $6-15k (stable; some COVID lab closures reduced supply)
2022-2023:  $8-18k (modest increase; photonics/MEMS demand growing)
2024-2025:  $8-15k (stable; supply exceeds demand)
2025-2026:  $8-15k (stable; FAVORABLE BUYER'S MARKET)

TREND: Thermal evaporators are COMMODITY ITEMS in the used market.
Every time a lab upgrades to e-beam or sputtering, they sell their
thermal system. Prices are STABLE and LOW.

KEY BUYERS:
├── Academic startup labs
├── MEMS packaging (Au/Cr adhesion layers)
├── Organic electronics / OPV research
└── Chalcogenide photonics (our niche ● very small market)

Facility Requirements

Floor Space and Layout

DimensionRequirement
Footprint (Denton DV-502A)0.7 m × 0.7 m (28" × 28") bell jar
Footprint (Lesker Nano 36)1.27 m × 0.94 m (50" × 37") rack assembly
Footprint (Nexdep)0.4 m × 0.4 m chamber + rack
With pump + glovebox2.0 m × 1.5 m (with adjacent nitrogen glove box)
Service access0.6 m clearance on all sides
Total floor allocation2.6 m × 2.1 m (5.5 m²)
Weight (Denton DV-502A)~200 kg (440 lbs)
Weight (Lesker Nano 36)~544 kg (1,200 lbs)
Weight (Nexdep)~150–300 kg

Electrical Requirements

ComponentPower DrawCircuit Requirements
Source power supply (LV, high-current)1.0–2.5 kW (6–10 V, 100–400 A)Single-phase 208/240 V, 30 A
Substrate heater0.2–0.5 kWSame circuit or separate 120V/15A
Turbo-molecular pump0.3–0.5 kWContinuous when tool is on
Roughing pump (dry scroll)0.5–0.8 kWContinuous when tool is on
QCM controller0.05 kWDuring deposition
Control PC + electronics0.1–0.2 kWContinuous
TOTAL SYSTEM2.5–4.5 kW typical; 5 kW peak40–50 A total on 2 circuits

NOTE: Thermal evaporators use LOW VOLTAGE, HIGH CURRENT source power supplies. The NANO 36 standard supply is 12V @ 400A. Heavy copper lugs are required between power supply and source feedthrough.

Environmental and Special Requirements

ParameterSpecification
Vibration sensitivityLOW ● thermal evaporation is NOT vibration-sensitive
Anti-vibration tableNot required
Special lightingAMBER/RED LIGHTING (≥ 580 nm cutoff) for As₂S₃ handling
Lighting reasonAs₂S₃ is photosensitive below ~600 nm; UV/blue exposure causes photodarkening (Δn up to 0.016)
Lighting cost$200–$400 for amber LED panels
Sound (roughing pump)60–70 dB(A) at 1 m
Sound (turbo pump)50–55 dB(A) (high-pitched whine)
Cooling water1–2 GPM if chamber is water-cooled; many bell-jar systems are air-cooled
TemperatureStandard lab 18–25°C
Humidity< 60% RH

Safety & Handling

Hazard Summary

HazardSourceRisk LevelControls
Arsenic exposureAs₂S₃ source material, residues on boats/chamberCRITICALLoad/unload in N₂ glovebox; OSHA PEL = 10 μg/m³ TWA for As
Toxic wasteAs₂S₃ on boats, crucibles, chamber wallsHIGHEPA D004 hazardous waste; licensed disposal
Thermal burnsHot source (300°C+), substrate heater (150°C)MEDIUMCool-down SOP; warning labels
ElectricalHigh-current supply (100–400 A)LOWInterlocked; LOTO for maintenance
Vacuum implosionBell-jar systemsLOWImplosion guard required on glass bell jars

Required Safety Infrastructure

ItemCostNotes
N₂ glovebox (#35)Shared equipmentFor As₂S₃ source loading/unloading
Personal arsenic exposure badges$100/packFor operators; quarterly monitoring
Area arsenic sampler$500–$1,500Continuous monitoring recommended
PPE (nitrile gloves, lab coat, safety glasses)$50/personStandard
N95 respirator$30/boxFor source loading operations
SDS binderAs₂S₃ SDS required on file
Hazmat waste containers$100–$200Labeled for arsenic-containing waste

Required Training

  • Arsenic handling and awareness (EH&S certified)
  • Vacuum system operation
  • QCM operation and calibration
  • Emergency procedures (arsenic spill response)
  • LOTO for electrical maintenance
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