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RF Magnetron Sputterer
MEDIUM ● ALD is preferred for TiN; sputterer provides flexibility for metals and dielectrics not covered by other toolsRole in QLT Fabrication
RF magnetron sputtering deposits metallic and dielectric thin films by bombarding a solid target with Ar⁺ ions from a plasma. The ejected atoms condense on the substrate. For QLT, the sputterer serves multiple roles:
- TiN heater backup ● reactive sputtering (Ti target + N₂/Ar) produces TiN faster than ALD but with less uniformity. Useful for rapid process development and fallback if ALD tool is down.
- Cr/Ti adhesion layers ● thin (5–10 nm) adhesion layers under Au contact pads when e-beam evaporator is unavailable or when different adhesion chemistry is needed.
- SiO₂ thin patches ● RF sputtering from SiO₂ target for localized cladding repairs or test structures (not primary cladding ● PECVD #24 handles that).
- Future materials ● LiNbO₃, PZT, or other piezoelectric/dielectric films for Poovey switch development (sputtering is a common deposition method for these materials).
Films Needed
| Film | Mode | Target | Gas | Thickness | Purpose |
|---|---|---|---|---|---|
| TiN | Reactive RF/DC | Ti target + N₂/Ar | N₂/Ar (10–30% N₂) | 20 nm | Heater resistors (backup to ALD) |
| Cr | DC | Cr target + Ar | Ar only | 5 nm | Adhesion layer under Au |
| Ti | DC | Ti target + Ar | Ar only | 10 nm | Adhesion layer (alternative to Cr) |
| SiO₂ | RF | SiO₂ target + Ar | Ar only | 100–500 nm | Thin cladding patch / test structures |
| Al₂O₃ | RF | Al₂O₃ target + Ar | Ar only | 10–50 nm | Passivation (alternative to ALD) |
| LiNbO₃ | RF | LiNbO₃ target + Ar/O₂ | Ar/O₂ mix | 200–500 nm | Future: Poovey switch piezoelectric |
Sputtering vs. ALD for TiN ● Detailed Comparison
| Parameter | RF Sputtering | ALD (#23) |
|---|---|---|
| Deposition rate | 20–50 nm/min (FAST) | 0.05 nm/cycle (~0.3 nm/min, SLOW) |
| Thickness control | ± 5 nm | ± 0.1 nm (50× better) |
| Conformality | ~60% (line-of-sight component) | > 99% (self-limiting surface reaction) |
| Step coverage | Poor in trenches and over topography | Excellent (> 95%) |
| Resistivity control | Variable (100–500 μΩ·cm) | Tight (150–250 μΩ·cm) |
| Film stress | Higher (compressive, tunable with power/pressure) | Lower, well-controlled |
| Equipment cost | $15k–$200k | $45k–$350k |
| Throughput | Higher (minutes per film) | Lower (67 min for 20 nm) |
| Verdict | Good for flat surfaces; fast; flexible | Preferred for our precision heaters |
Recommended Configuration
| Parameter | Specification |
|---|---|
| Manufacturer | AJA International, Inc., Scituate, MA |
| Model | ATC Orion 5 (compact HV sputtering system) |
| Website | ajaint.com |
| Contact | [email protected] |
| Chamber | 14" diameter, con-focal geometry |
| Sputter sources | Up to 5 × 3" magnetron sources (con-focal) or up to 8 × 2" sources |
| Source types | Stiletto (HV) and A300-XP (UHV) magnetron sputtering sources |
| Source features | Tuning chimneys (patent pending); flip-top shutters; gas injection rings |
| Target change | 2-screw removal ● fast, tool-free target access |
| Power options | RF (13.56 MHz), DC, Pulsed DC, HiPIMS ● customer selectable per source |
| Substrate holder | Motorized rotation (0–40 rpm); up to 6" (150 mm) diameter |
| Substrate heating | Radiant, up to 800–1000°C (size-dependent) |
| Substrate cooling | H₂O or LN₂ options |
| Substrate bias | RF or DC bias capability |
| Z-motion | In-situ motorized, 50 mm travel (working distance adjustment) |
| Gas lines | Up to 4 MFC-controlled (Ar, O₂, N₂, H₂ etc.) |
| Vacuum | Turbomolecular pump + dry backing; HV (10⁻⁷ Torr) or UHV (10⁻¹⁰ Torr) |
| Load-lock | Turbopumped load-lock available |
| Control | Semi-automatic or LabVIEW-based computer control |
| Uniformity | ± 2.5% across 6" diameter (con-focal geometry) |
| Multi-chamber | Can connect to other Orion/ATC systems for multi-technique configurations |
| Deposition rates | Up to 18 Å/s (Au), 9 Å/s (Cu), 0.16 Å/s (Al₂O₃ RF) with 2" sources |
| Price range | $125,000–$350,000 (per AJA website, 2026) |
| Lead time | 8–14 weeks (standard modules often in stock) |
| Parameter | RF Sputtering | ALD (#23) |
|---|---|---|
| Deposition rate | 20–50 nm/min (FAST) | 0.05 nm/cycle (~0.3 nm/min, SLOW) |
| Thickness control | ± 5 nm | ± 0.1 nm (50× better) |
| Conformality | ~60% (line-of-sight component) | > 99% (self-limiting surface reaction) |
| Step coverage | Poor in trenches and over topography | Excellent (> 95%) |
| Resistivity control | Variable (100–500 μΩ·cm) | Tight (150–250 μΩ·cm) |
| Film stress | Higher (compressive, tunable with power/pressure) | Lower, well-controlled |
| Equipment cost | $15k–$200k | $45k–$350k |
| Throughput | Higher (minutes per film) | Lower (67 min for 20 nm) |
| Verdict | Good for flat surfaces; fast; flexible | Preferred for our precision heaters |
| Parameter | Specification |
|---|---|
| Manufacturer | AJA International, Inc., Scituate, MA |
| Model | ATC Orion 5 (compact HV sputtering system) |
| Website | ajaint.com |
| Contact | [email protected] |
| Chamber | 14" diameter, con-focal geometry |
| Sputter sources | Up to 5 × 3" magnetron sources (con-focal) or up to 8 × 2" sources |
| Source types | Stiletto (HV) and A300-XP (UHV) magnetron sputtering sources |
| Source features | Tuning chimneys (patent pending); flip-top shutters; gas injection rings |
| Target change | 2-screw removal ● fast, tool-free target access |
| Power options | RF (13.56 MHz), DC, Pulsed DC, HiPIMS ● customer selectable per source |
| Substrate holder | Motorized rotation (0–40 rpm); up to 6" (150 mm) diameter |
| Substrate heating | Radiant, up to 800–1000°C (size-dependent) |
| Substrate cooling | H₂O or LN₂ options |
| Substrate bias | RF or DC bias capability |
| Z-motion | In-situ motorized, 50 mm travel (working distance adjustment) |
| Gas lines | Up to 4 MFC-controlled (Ar, O₂, N₂, H₂ etc.) |
| Vacuum | Turbomolecular pump + dry backing; HV (10⁻⁷ Torr) or UHV (10⁻¹⁰ Torr) |
| Load-lock | Turbopumped load-lock available |
| Control | Semi-automatic or LabVIEW-based computer control |
| Uniformity | ± 2.5% across 6" diameter (con-focal geometry) |
| Multi-chamber | Can connect to other Orion/ATC systems for multi-technique configurations |
| Deposition rates | Up to 18 Å/s (Au), 9 Å/s (Cu), 0.16 Å/s (Al₂O₃ RF) with 2" sources |
| Price range | $125,000–$350,000 (per AJA website, 2026) |
| Lead time | 8–14 weeks (standard modules often in stock) |
| Parameter | Specification |
|---|---|
| Manufacturer | Kurt J. Lesker Company, Jefferson Hills, PA |
| Model | PRO Line PVD 75 (magnetron sputtering configuration) |
| Website | lesker.com |
| Chamber | 304L SS box, 15.25" × 16.5" × 24" (75 L), with 10 spare CF ports |
| Sputter sources | Up to 6 × Torus® 2"/3" sources, or up to 4 × 4" Mag-Keeper sources |
| Mag-Keeper | Zero o-rings in cathode body; magnetically coupled target; dome shutter |
| Power | 2 kW pulsed DC per source; RF power supplies available |
| Substrate | Up to 6" (150 mm) with rotation (20 rpm), heating to 850°C, RF bias |
| Pumping | 790 L/s turbo (Pfeiffer) standard; optional CTI-8F 1500 L/s cryopump |
| Base pressure | Standard: 10⁻⁷ Torr; UHV option: 10⁻¹⁰ Torr |
| Uniformity | ≤ ± 5% (sputtering) across 150 mm |
| Gas control | 2-channel upstream MFC with pressure control |
| Load-lock | Automated transfer available |
| Footprint | 47" × 35" × 75" (1194 × 889 × 1905 mm) |
| Compliance | CE, CSA; 12-month warranty |
| Price range | $80,000–$150,000 (estimated, 2026) |
| Lead time | 10–14 weeks |
| 400+ units in service worldwide |
Process Integration
QLT PROCESS FLOW ● RF Magnetron Sputterer (Step B6-alt / Adhesion Layers): STEP 1: Target Installation ├── Mount required target(s) in magnetron source(s) │ (e.g., Ti in gun #1, Cr in gun #2, SiO₂ in gun #3) ├── AJA: 2-screw removal for quick target change └── Verify target bonding to backing plate (for heat transfer) STEP 2: Load Substrate ├── Mount chip on substrate holder (center position) ├── Verify rotation and heating if needed └── Close chamber (or load through load-lock) STEP 3: Pump Down ├── Rough to < 100 mTorr ├── Turbo pump to base pressure < 5×10⁻⁶ Torr └── Wait for stable base (5–15 min) STEP 4: Pre-Sputter (Target Conditioning) ├── Flow Ar at 20 sccm; set pressure 5 mTorr ├── Strike plasma on target at 100 W ├── Pre-sputter with shutter closed for 5 min └── Removes oxide layer from target surface STEP 5: Deposition ├── Open shutter; start substrate rotation ├── For reactive TiN: add N₂ flow (5 sccm), monitor with OES ├── Deposit to target thickness (QCM or timed) └── Close shutter when done STEP 6: Sequential Layers (if needed) ├── Switch to next target gun (motorized or manual index) ├── Pre-sputter 2 min; then deposit └── Repeat for all layers STEP 7: Cool & Unload ├── Wait 5 min for substrate cooling ├── Vent with dry N₂ └── Remove chip for next process step STEP 8: Quality Verification ├── Profilometer: verify thickness ├── 4-point probe: verify resistivity (TiN, metals) ├── Tape test: verify adhesion └── XRD/EDS: verify composition (if TiN)
Vendor Options & Pricing
New System Pricing
| Model | Manufacturer | Targets | Price (2025–2026) | Lead Time |
|---|---|---|---|---|
| AJA ATC Orion 5 | AJA International (MA) | 3–5 × 3" guns | $125,000–$200,000 | 8–12 weeks |
| AJA ATC Orion 8 | AJA International (MA) | 5–8 × 2" guns | $175,000–$350,000 | 10–14 weeks |
| Kurt Lesker PRO Line PVD 75 | Lesker (PA) | 4–6 Torus® guns | $80,000–$150,000 | 10–14 weeks |
| Denton Vacuum Discovery | Denton (NJ) | 2–4 guns | $60,000–$120,000 | 8–12 weeks |
| Angstrom Engineering Amod | Angstrom (Canada) | 4–6 guns | $100,000–$180,000 | 10–16 weeks |
Refurbished Market
| Model | Condition | Price | Lead Time | Source |
|---|---|---|---|---|
| CVC 601 / AST | Used, various | $10,000–$25,000 | 2–4 weeks | LabX, Surplus Record |
| Perkin-Elmer 2400 / 4450 | Used | $8,000–$20,000 | 2–4 weeks | LabX, Used-Line |
| MRC / Randex | Used | $5,000–$15,000 | 1–3 weeks | Surplus Record |
| Denton DV-502A (with sputter head) | Used | $5,000–$15,000 | 1–3 weeks | eBay, Surplus Record |
| AJA Orion (early models) | Used, rare | $40,000–$80,000 | 4–8 weeks | LabX |
| Kurt Lesker PVD 75 (used) | As-is | $25,000–$50,000 | 2–6 weeks | SemiStar, LabX |
Vendor Directory
| Vendor | Type | Contact | Notes |
|---|---|---|---|
| AJA International | OEM | ajaint.com / Scituate, MA | Market leader in research sputtering |
| Kurt J. Lesker | OEM | lesker.com / Jefferson Hills, PA | 400+ PVD 75 units installed; Torus® sources |
| Denton Vacuum | OEM | dentonvacuum.com / Moorestown, NJ | Discovery series; compact |
| Angstrom Engineering | OEM | angstromengineering.com / Kitchener, ON | Amod platform; multi-technique |
| LabX | Used marketplace | labx.com | AJA, Lesker, CVC listings |
| Used-Line | Aggregator | used-line.com | Perkin-Elmer, CVC |
| Surplus Record | Industrial surplus | surplusrecord.com | Older systems (MRC, Randex) |
| SemiStar | Used dealer | semistarcorp.com | PVD 75 and others |
| CAE Online | Used semiconductor | caeonline.com | Sputtering system listings |
| FabSurplus | Used semiconductor | fabsurplus.com | Industrial surplus |
AJA Pricing Context
AJA publicly lists their price ranges on their website (rare in the industry):
- Orion Series: $125,000–$350,000
- ATC Series (larger): $175,000–$950,000+
This transparency is helpful for budgeting. The Orion 5 at the $125k–$200k entry point delivers 3–5 con-focal sources with excellent uniformity for research/pilot work.
Facility Requirements
Space and Utilities
| Parameter | Specification |
|---|---|
| Power | 3-phase, 208V, 30A (RF supply + DC magnetron + pump) |
| RF power supply | 13.56 MHz, 300–600 W per source (typically 1–2 active simultaneously) |
| DC power supply | 0–1000V, 0–2A per source (for metal sputtering) |
| Pulsed DC | Optional; reduces arcing on dielectric targets |
| Gases | Ar (primary, 99.999%); N₂ (reactive TiN); O₂ (reactive oxides) |
| Gas delivery | MFC controlled, 4 channels minimum |
| Cooling | Recirculating chiller, 3–5 kW thermal ● MANDATORY |
| Cooling reason | Magnetron guns generate significant heat; targets can crack without cooling |
| Vacuum | Turbomolecular pump + dry backing pump (typically integrated) |
| Exhaust | Pump exhaust to building vent (no toxic byproducts for Ar-only sputtering) |
| N₂ reactive | If reactive sputtering with N₂: vent to exhaust; no special scrubbing needed |
| Floor space | 1.2 m × 1.2 m (chamber + electronics rack) |
| With chiller + gas panel | 2.0 m × 1.5 m total |
| Weight | 200–400 kg (Orion 5); up to 600 kg (PVD 75) |
| Vibration | Not sensitive |
| Temperature | Standard lab 18–25°C |
Electrical Detail
| Component | Power Draw | Notes |
|---|---|---|
| RF power supply (13.56 MHz) | 300–600 W | Per source; typically 1–2 active |
| DC power supply | 200–500 W | For metal sputtering |
| Turbo pump | 300–500 W | Continuous |
| Roughing pump | 500–800 W | Continuous |
| Substrate heater (if used) | 500–2000 W | During deposition |
| Chiller | 1000–3000 W | Continuous |
| Control electronics | 200–500 W | Continuous |
| TOTAL SYSTEM | 3–8 kW typical | Moderate power consumer |
Safety & Handling
Hazard Summary
| Hazard | Source | Risk Level | Controls |
|---|---|---|---|
| RF radiation | 13.56 MHz generator | LOW | Shielded chamber; interlocks on all doors |
| Electrical shock | DC/RF power supplies | MEDIUM | LOTO for target changes; interlocked |
| Compressed gas | Ar, N₂, O₂ cylinders | LOW | Standard cylinder handling; secured to wall |
| Hot surfaces | Magnetron guns, substrate heater | MEDIUM | Cool-down SOP before target change |
| Target debris | Broken or cracked targets | LOW | Inspect targets before loading; cooling mandatory |
| Plasma UV/visible | Sputtering plasma glow | LOW | Don't stare directly at plasma through viewport |
Target Handling
| Material | Special Handling | Storage |
|---|---|---|
| Ti | None ● safe metal | Ambient; sealed bag to reduce oxidation |
| Cr | Hexavalent Cr concerns (Cr⁶⁺) during sputtering | Standard storage; EH&S review for Cr sputtering |
| SiO₂ | Ceramic ● fragile; can crack from thermal shock | Handle with care; ramp power slowly |
| Al₂O₃ | Ceramic ● fragile | Handle with care |
| LiNbO₃ | Ceramic ● fragile; expensive | Sealed container; handle with gloves |